[Date: 07-04-06] Image Technology News Release Image Technology Today Announces ISO 9001:2000 Certification [Date: 07-02-06] Image Technology Announces The Acquisition of Their New Lasertec Large Area Photomask Defect Inspection Tool [Date: 11-11-04] Amkor, Unitive and SECAP Successfully Conclude Venture for 300mm Electroplated Wafer Bumping Line [Date: 08-07-03] Image Technology Introduces New Cost Reduction Technology for Photomasks [Date: 04-07-03] SECAP Successfully Installs Complete 300 mm Electroplated Wafer Bumping Line at Unitive Semiconductor Taiwan [Date: 18-06-03] SUSS MicroTec Boosts Full-Field Lithography with New SupraYield Technology Provides clear path to future needs of advanced packaging and other markets [Date: 22-07-02] SECAP to Install 300 mm Electroplating Bumping Line in Asia Open to the Industry [Date: 12-07-02] SUSS MicroTec Gets Order for 300 mm Mask Aligner From Siliconware Precision Industries [Date: 17-06-02] SUSS MicroTec´s Image Technology Division Expands Photomask Operations Into Asia [Date: 12-02-02] SUSS MicroTec wins multiple 200-mm production tool orders from a leading semiconductor test and assembly service provider LithoPack300: 300 mm Lithography Cluster for Wafer Level Packaging [Date: 21-03-01] SUSS MicroTec Acquires Leading Precision Photomask Manufacturer [Date: 13-09-00] "SECAP" International Advanced Packaging Consortium Formed to Standardize Wafer Level Technologies [Date: 09-05-00] New partnership paves the way for cost effective production of wafer-level CSP's [Date: Apr 2000] 9-in.Precision Photomasks for Advanced PackagingApplications (PDF)