SUSS MicroTec Gets Order for 300 mm Mask Aligner From Siliconware Precision Industries

Munich--July 12, 2002--SUSS MicroTec announced a key order for its newly introduced MA300Plus Mask Aligner from Siliconware Precision Industries (SPIL), the world's third largest semiconductor packaging and testing company headquartered in Taiwan. The MA300Plus was chosen over alternative technologies due to its low cost of ownership for high volume manufacturing of solder bumped wafers.

The MA300Plus represents the next-generation Mask Aligner technology for SUSS MicroTec and offers a higher level of tool automation compared to previous systems. The MA300Plus is specifically designed for wafer bumping and wafer-level packaging applications on 300 mm and 200 mm wafers and is an attractive solution for integrated device manufacturers (IDMs), foundries and wafer bumping foundries.

Wafer-level packaging is an advanced packaging technology whereby the die and package are manufactured and tested on the wafer, then diced into individually packaged integrated circuits (ICs). 300 mm wafer-level packaging technology is vital for continuous improvement in the quality and cost of high-technology products.

"This strategically important order from SPIL for the MA300Plus full-field Mask Aligner further strengthens our market leadership in advanced packaging", commented James Quinn, general manager of the Advanced Packaging Business Unit of SUSS MicroTec. "We are convinced that our solutions are the perfect match for advanced packaging applications in today's state of the art fabs."

The MA300Plus requires 14-inch photomasks to expose a 300 mm wafer in one step and 9-inch photomasks for 200 mm wafers. The MA300Plus uses an integrated mask stocker to allow for a fully automatic handling of these masks to guarantee maximum safety. SUSS MicroTec's wholly owned subsidiary, Image Technology, a key supplier of such large area precision photomasks based in Palo Alto, Calif., just recently announced that they will open a new facility in Taiwan to support their Asian customer base. This substantial strengthening of the photomask infrastructure will allow Taiwanese users of Mask Aligners to buy quality masks locally.

About SUSS MicroTec
SUSS MicroTec is a leading supplier of production and process technology for the semiconductor industry. SUSS MicroTec primarily services emerging markets, which are currently converting to new technologies thereby ensuring their continued ability to compete. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 1,000 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. More information about SUSS MicroTec and its products is available from its web site at www.suss.com or www.suss.de.