SUSS MicroTec wins multiple 200-mm production tool orders from a leading semiconductor test and assembly service provider

Munich, February 2002 - SÜSS MicroTec AG (Frankfurt Stock Exchange Neuer Markt: SMH), has won multiple orders for 200-mm advanced packaging volume production tools from a leading semiconductor test and assembly service provider to fabless companies, integrated device manufacturers and wafer foundries in Singapore. SUSS MicroTec's 200-mm product portfolio was chosen over alternative technologies due to the highly complimentary stand alone systems which improves throughput, quality and reliability while reducing cost on a wide range of advanced technology products such as mobile telecommunications, telecomputing, wireless networking and consumer electronics.

Wafer level packaging is an advanced packaging technology, whereby the die and 'package' are manufactured and tested on the wafer, then diced into individually packaged ICs for continuous improvement in the quality and cost of high-technology products. The 200-mm stand alone tool set is a fully automated solution used to coat, expose and develop patterned wafers for wafer level packaging (WLP) applications. According to James A. Quinn, General Manager of the Advanced Packaging Business Unit for SUSS MicroTec "this mutiple tool order continues to validate the 200 series platform as a total system solution for our customers which establishes the SUSS product portfolio as the critical choice for volume production and further strengthens our market leadership in advanced packaging".

SUSS MicroTec's 200-mm solution consists of a stand alone MA200 automated Mask Aligner with a 5k watt light source for extremely fast throughput capability in a high volume manufacturing environment. In addition to the Mask Aligner the order consists of two (2) stand alone ACS200 spin-coating systems to compliment the lithography component of the manufacturing line. The MA200 and ACS200 are specifically designed for wafer bumping and wafer level packaging applications on 200-mm wafers or smaller. The 200 series is an attractive solution not only to mass manufacturers of 200-mm wafers but also to wafer bumping service providers with only limited volumes and various sized wafers.
The MA200 Mask Aligner requires 9-inch photomasks to expose a 200-mm wafer in one step. SUSS MicroTec's wholly owned subsidiary, Image Technology, a key supplier of precision photomasks based in Palo Alto, California, specializes in large area precision photomasks. Photomasks are offered in conjunction with the mask aligners which further reduce cost of ownership models and enable SUSS to take another step towards offering a total system solution to its customers.