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Image Technology Introduces New Cost Reduction Technology for Photomasks MPT service reduces cost of ownership, enables sub-micron printing for full-field lithography users Palo Alto, Calif. - July 8, 2003 - Image Technology Inc., a wholly-owned subsidiary of SUSS MicroTec, has introduced a new pellicle service that further reduces cost of ownership of 1X photomasks. By using the service, customers can have their full-field photomasks (up to 14 inches) protected from contamination with Mask Pellicle Technology (MPT). This service allows immediate customer access to fully-inspected photomasks using this unique technology without the need for customers to invest in their own pellicle application process and inspection equipment. MPT is an integral component of SUSS MicroTec's SupraYield Technology, an offering of four technologies that collectively extend resolution, overlay, throughput and cost of ownership of 1X full-field lithography (1XFFL). MPT involves coating a full-field photomask with a thin layer that protects the mask from being contaminated with resist residue and particles from the wafer during exposures. This effectively eliminates mask cleaning in proximity printing and, even, in contact printing, making 1XFFL a cost-effective lithography solution for volume production of thick-resist applications, such as advanced packaging, MEMS and LED. In fact, 1XFFL systems using masks with MPT in vacuum printing have produced more than 800 prints with resolution down to 0.75 micron and smaller, without mask cleaning. Doug Resnick, section manager in the Advanced Process Characterization Laboratories at Motorola, and co-inventor of the technology said, "Considering the mounting costs of steppers, alternative technologies including contact and imprint lithography are worthy of renewed examination especially given the availability of new release materials and techniques. Lowering the surface energy of the mask is key for reducing contamination and the newest materials available represent enabling technology." MPT enables 1XFFL systems to perform high-resolution printing, comparable to or better than 1X steppers at significantly lower costs, by allowing the mask to be placed near the wafer without the risk of mask contamination or need for cleaning. As the gap between mask and wafer gets smaller, image resolution increases. The MPT protective layer does not affect the 1XFFL system's imaging capabilities because of its sub-micron thickness. "We are very pleased to make this service available to customers,"
said Jim Quinn, president and CEO of Image Technology Inc. "With
our new MPT service, existing photomask production capabilities and 1XFFL
systems from SUSS, volume manufacturers have a complete, full-field lithography
solution that offers the cost efficiencies and performance capabilities
required by next-generation, thick-resist applications."
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made. |