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SECAP Successfully Installs Complete 300 mm Electroplated Wafer Bumping Line at Unitive Semiconductor Taiwan SECAP Brings High-Volume Production On Line; Takes Leadership Role in Real World 300 mm Packaging Technology SAN FRANCISCO, Calif.-July 3, 2003 -The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) today announced it has successfully installed a 300 mm wafer bumping and wafer-level packaging (WLP) line at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan. UST, an affiliate of Unitive, Inc. will use the installed integrated process equipment from the SECAP member companies for high-volume manufacturing. This is the first fully integrated 300 mm electroplated wafer bumping line installed at a wafer level packaging service provider for immediate high-volume production. Originally announced in July 2002, SECAP and Unitive agreed to install the 300 mm wafer bumping line to address the burgeoning demands of wafer level packaging. With the SECAP process installation complete, the 300 mm line is now available to customers and prospective customers of SECAP member companies for equipment demonstrations and processing evaluation. "This is an important strategic development that positions Unitive to further benefit from the transition to 300mm technology," said Daniel Teng, president of UST." "We're excited that the line is up and running in such a short time. This, again, proves the professionalism of all companies involved. For SECAP, Unitive is the ideal partner for this project because Unitive already uses SECAP equipment in their 200 mm lines, and because Unitive has a leading electroplating and redistribution technology," noted Franz Richter, president and CEO for Suss MicroTec. "We believe we are offering a unique and excellent opportunity for our customers to see a fully-equipped 300 mm high-volume production line for wafer bumping and wafer level packaging in a real world production environment." Richter further commented that qualification of SECAP 300 mm equipment for the Unitive process validates the capability of SECAP equipment for the most demanding and advanced wafer-level packaging processes. "With this collaboration, Unitive and SECAP continue to set the standard for wafer level packaging technologies. We will continue to offer the industry the most advanced and reliable technologies, which meet production needs today and provide a clear path for future needs," commented Dan Mis, vice president of Applications Engineering for Unitive. The SECAP line enables member companies to further optimize their equipment for the integrated process flow of typical wafer bumping lines. A seamless process flow is crucial for a successful move to WLP, since different equipment technologies cannot be viewed in isolation because of the interdependency and integration required in establishing a complete process line. According to the SECAP charter, SECAP is neutral to all packaging technologies and welcomes the opportunity to work with all manufactures. Wafer-level packaging requires a strong infrastructure. The SECAP consortium, therefore, works with its customers to deliver a toolset with which our customers can rapidly bring their process online. SECAP members provide process support, but do not sell or license process technology. About Unitive, Inc. Unitive is the leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. The manufacturing factories are located in N.C., USA and its affiliated company UST, located in Taiwan. The company partners with its customers to meet their product and global manufacturing needs through innovative deployment of its technologies, resulting in quicker time-to-market and lower costs. Unitive's services include wafer level multi-level passivation and thin film wiring, solder bumping, and chip scale packaging. The company's strategic investors include leading financial and industry pioneers such as Onex, Celestica, Flextronics, Fairchild Semiconductor, and Conexant Systems. For more information, please visit www.unitive.com. Unitive Contact:
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